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  1 publication date: july 2010 ver. aeb data sheet part no. package code no. AN26011A ssmini-5dc
AN26011A 2 ver. aeb contents ? overview ???????????????????.??????????????????????. 3 ? features ???????????????????.??????????????????????. 3 ? applications ??????????????????.??????????????????????. 3 ? package ???????????????????.??????????????????????. 3 ? type ?????????????????????.??????????????????????. 3 ? application circuit example ?????.?????.??????????????????????. 4 ? pin descriptions ?????????????????????????????????????.. 6 absolute maximum ratings ????????????????.????????????????. 7 ? operating supply voltage r ange ???????????????.?? ?????????????. 7 ? allowable current and voltage range ???????????? ?????????? ??????? 8 electrical characteristics ??????????????????????????????????. 9 ? electrical characteristics (reference values for design) ????????????????????? 11 ? control pins mode table ???????????? ???????????? ??????????. 13 ? technical data ??????????????????.????????????????????. 14 y p d ? t a diagram ?????????????????????????????????????. 14 ? usage notes ????????????????. ????????????? ??????????. 15
AN26011A 3 ver. aeb AN26011A lna-ic for 800 mhz / 450 mhz band applications ? overview y AN26011A is lna-ic for 800 mhz / 450 mhz band applications. y realizing high performance by using 0.18 m sigec bi-cmos process (f t = 90 ghz, f max = 140 ghz). y sleep mode is available, controlled by integrated cmos logic circuit. y achieving miniaturization by using small size package. ? features y low voltage operation +2.80 v typ. y high gain 15.0 db typ. frx = 881.5 mhz 16.0 db typ. frx= 450 mhz y low noise figure 1.50 db typ. frx = 881.5 mhz 1.40 db typ. frx= 450 mhz y low distortion +10.0 db m typ.frx = 881.5 mhz +10.0 dbm typ. frx= 450 mhz (iip3 +10 mhz offset) y small package ? applications y 800mhz band applications y 450mhz band applications ? package y 5 pin plastic small surface mount package (smini type) ? type y bi-cmos ic
AN26011A 4 ver. aeb ? application circuit example in out v cc 1000 pf out in gnd v cc cnt (gain control) 54 123 12 nh 4.0 pf notes) this application circuit is shown as an example but does not guarantee the de sign for mass production set. y 800 mhz band applications 0.1 f 4.0 pf 10 nh 12 nh
AN26011A 5 ver. aeb ? application circuit example (continued) notes) this application circuit is shown as an example but does not guarantee the de sign for mass production set. 0.1 f v cc 2.0 pf out in gnd v cc cnt (gain control) 4.5 pf 22 nh 54 123 10 12 nh 1000 pf 1.3 k 0.5 pf in out y 450 mhz band applications
AN26011A 6 ver. aeb ? pin descriptions rf output output out 5 v cc power supply vcc 4 high-gain / low-gain sw input cnt 3 gnd ground gnd 2 rf input input in 1 description type pin name pin no.
AN26011A 7 ver. aeb ? absolute maximum ratings ? operating supply voltage range ? ma 18 i cc supply current 2 notes unit rating symbol parameter a no. *3 c ?55 to +125 t stg storage temperature 5 *3 c ?20 to +70 t opr operating ambient temperature 4 *2 mw 64.8 p d power dissipation 3 *1 v 3.6 v cc supply voltage 1 notes unit range symbol parameter * v 2.65 to 2.95 v cc supply voltage range notes) *: the values under the condition not exceeding the above absolute maximum ratings and the power dissipation note) absolute maximum ratings are limit values which are not dest ructed, and are not the values to which operation is guarantee d. notes) *1 : the values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : the power dissipation shown is the value at t a = 70 c for the independent (unmounted) ic package without a heat sink. when using this ic, refer to ? p d -t a diagram in the ? technical data and design the heat radiati on with sufficient ma rgin so that the allowable value might not be exceeded based on the conditi ons of power supply voltage, load, and ambient temperature. *3 : except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for t a = 25 c.
AN26011A 8 ver. aeb ? allowable current and voltage range ? in notes unit rating pin name pin no. *2 v ? 0.3 to (v cc + 0.3) out 5 *2 v ? 0.3 to (v cc + 0.3) cnt 3 *1 v 1 note) *1 do not apply more than 0 dbm to rf input rf signal input pin. do not apply dc current. *2 (v cc + 0.3) v must not be exceeded 3.6 v notes) y allowable current and voltage ranges are limit ranges which are not destructed, and are not the ranges to which operation is gua ranteed. y voltage values, unless otherwise specified, are with respect to gnd. y do not apply external currents or voltages to any pin not specifically mentioned. y for the circuit currents, "+" denotes current flowing into the ic, and " ? " denotes current flowing out of the ic.
AN26011A 9 ver. aeb ? electrical characteristics at v cc = 2.80 v ? a 35 5 ? cnt current at active mode no input signal icnths cnt current (high gain mode) dc-3 ? a 10 0 ? cnt current at sleep mode no input signal icntls cnt current (low gain mode) dc-4 ? v 3.1 ? 2.52 vihs cnt voltage (high gain mode) dc-5 ? a 10 0 ? v cc current at sleep mode no input signal iccls supply current (low gain mode) dc-2 ? ma 14.5 11.5 ? v cc current at active mode no input signal icchs supply current (high gain mode) dc-1 dc electrical characteristics ? v 0.3 0 ? vils cnt voltage (low gain mode) dc-6 limits typ unit max notes min conditions symbol parameter b no. notes) all parameters are specified under t a = 25 c 2 c unless otherwise specified.
AN26011A 10 ver. aeb ? electrical characteristics (continued) at v cc = 2.80 v ? dbm ? 10.0 6.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz input 2 signals (f1, f2) iip3s iip3 +10 mhz offset a-2 lna ac electrical characteristics ( low gain mode ) ? db ?1.5 ?3.0 ?5.0 prx a= ?20 dbm gls power gain lg a-3 lna ac electrical characteristics ( high gain mode ) ? db 17.0 15.0 13.0 ghs power gain hg a-1 limits typ unit max notes min conditions symbol parameter b no. note) all parameters are specified under t a = 25 c 2 c, frxa = 881.5 mhz, prxa = ?30 dbm, cw unless otherwise specified.
AN26011A 11 ver. aeb ? electrical characteristics (reference values for design) at v cc = 2.8 v ? db ? 7.5 5.5 s11ha input return loss hg b-7 ? db ? 9.0 7.0 s22ha output return loss hg b-8 ? dbm ? 10.0 6.0 f1 = frxa ? 10 mhz f2 = frxa ? 20 mhz input 2 signals (f1, f2) iip3h2a iip3 ?10 mhz offset hg b-4 ? dbm ? ?6.0 ?10.0 ip1dbha input p1db b-5 ? db ?18 ?22.0 ? isoha reverse isolation hg b-6 ? dbm ? 20.0 17.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz prxa = ?15 dbm input 2 signals (f1, f2) iip3l1a iip3 +10 mhz offset lg b-11 ? db ?1.5 ?3.0 ?5.0 prxa = ?20 dbm gla power gain lg b-9 ? db 5.5 3.0 ? nfla noise figure lg b-10 lna ac electrical characteristics ( low gain mode ) ? db ? 9.0 7.0 s11la input return loss lg b-13 ? db ? 7.5 5.5 s22la output return loss lg b-14 *1 db 2.1 1.5 ? nfha noise figure hg b-2 ? dbm ? 10.0 6.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz input 2 signals (f1, f2) iip3h1a iip3 +10 mhz offset hg b-3 lna ac electrical characteristics ( high gain mode ) ? db 17.0 15.0 13.0 gha power gain hg b-1 ? db ?1.5 ?3.0 ?5.0 isola reverse isolation lg b-12 reference values typ unit max notes min conditions symbol parameter b no. note) y all characteristics are specified under t a = 25 c 2 c, frxa = 869 mhz, 881.5 mhz, 894 mhz, prxa = ?30 dbm, cw y the characteristics listed below are reference values derived from the design of the ic and are not guaranteed by inspection. if a problem does occur related to these characteristic s, we will respond in good faith to user concerns. note) *1 : connector & substrate loss (0.1 db) included.
AN26011A 12 ver. aeb ? electrical characteristics (reference values for design ; continued) at v cc = 2.8 v ? db ? 7.5 5.5 s11hc input return loss hg d-7 ? db ? 7.5 5.0 s22hc output return loss hg d-8 ? dbm ? 10.0 6.5 f1 = frxb ? 10 mhz f2 = frxb ? 20 mhz input 2 signals (f1, f2) iip3h2c iip3 ?10 mhz offset hg d-4 ? dbm ? ?7.0 ?11.0 ip1dbhc input p1db d-5 ? db ?20.0 ?24.0 ? isohc reverse isolation hg d-6 ? dbm ? 25.0 22.0 f1 = frxa + 10 mhz f2 = frxa + 20 mhz prxa = ?10 dbm input 2 signals (f1, f2) iip3l1c iip3 +10 mhz offset lg d-11 ? db ?1.5 ?3.0 ?4.5 prxb = ?20 dbm glc power gain lg d-9 ? db 5.0 3.0 ? nflc noise figure lg d-10 lna ac electrical characteristics ( low gain mode ) ? db ? 10.0 8.5 s11lc input return loss lg d-13 ? db ? 15.0 12.0 s22lc output return loss lg d-14 *1 db 2.1 1.4 ? nfhc noise figure hg d-2 ? dbm ? 10.0 6.5 f1 = frxb + 10 mhz f2 = frxb + 20 mhz input 2 signals (f1, f2) iip3h1c iip3 +10 mhz offset hg d-3 lna ac electrical characteristics ( high gain mode ) ? db 18.0 16.0 14.0 ghc power gain hg d-1 ? db ?1.5 ?3.0 ?4.5 isolc reverse isolation lg d-12 reference values typ unit max notes min conditions symbol parameter b no. note) *1 : connector & substrate loss (0.1 db) included. note) y all characteristics are specified under t a = 25 c 2 c, frxb = 440 mhz, 450 mhz, 460 mhz, prxb = ?30 dbm, cw y the characteristics listed below are reference values derived from the design of the ic and are not guaranteed by inspection. if a problem does occur related to these characteristic s, we will respond in good faith to user concerns.
AN26011A 13 ver. aeb ? control pins mode table note) control voltage range : see b no. dc-5 / b no. dc-6 at page 9 pin voltage high gain high ? low gain gain control 3 remarks low description pin no.
AN26011A 14 ver. aeb ? technical data y p d ? t a diagram
AN26011A 15 ver. aeb ? usage notes y special attention and precaution in using 1. this ic is intended to be used for general elec tronic equipment [880 mhz / 450 mhz band applications]. consult our sales staff in advance for in formation on the foll owing applications: x special applications in which ex ceptional quality and reli ability are required, or if the fail ure or malfunction of this ic may directly jeopardize life or harm the human body. x any applications other than the standard applications intended. (1) space appliance (such as artificial satellite, and rocket) (2) traffic control equipment (such as fo r automobile, airplane, train, and ship) (3) medical equipment for life support (4) submarine transponder (5) control equipment for power plant (6) disaster prevention and security device (7) weapon (8) others : applications of which reliability equivalent to (1) to (7) is required 2. pay attention to the direction of lsi. when mounting it in the wrong direction onto the pcb (printed-circuit-board), it might smoke or ignite. 3. pay attention in the pcb (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. in addition, refer to the pin description for the pin configuration. 4. perform a visual inspection on the pcb be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. also, perfo rm a full technical verification on the assembly quality, becau se the same damage possibly can happen due to conductive substanc es, such as solder ball, that adhere to the lsi during transportation. 5. take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- v cc short (power supply fault), output pin-gnd short (ground fault), or output-to-output-pin short (load short) . and, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage a nd operating environment etc.). esp ecially, please be careful not to exceed the range of absolu te maximum rating on the transient state, such as power-on, power-off and mode -switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, ta ke into the consideration of incidence of break down and failur e mode, possible to occur to semiconductor produc ts. measures on the system s such as redundant design, arresting the spread of fi re or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the produ cts. 7. when using the lsi for new models, verify the safe ty including the long-term reliability for each product. 8. when the application system is designed by using this lsi, be sure to confirm notes in this book. be sure to read the notes to descriptions and the usage notes in the book.
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. no license is granted in and to any intellectual property right or other right owned by panasonic corporation or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202


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